This new film is designed for optimal thermal connections in the fields of computer technology and high-performance automotive applications.
With its outstanding thermal conductivity and very good compressibility the film is very well suited for these types of applications. The material’s good formability reduces mechanical stress on the power components.
Possible Thickness: 0.5mm – 3.0mm
Stress Sensitive Components
Property Symbol Unit 86/525 * – Youngs Modulus sample size 30x30x2.5mm3;
– variable contact pressure;
– compression 50% of measured thickness;
Color violet Thermal Properties Thermal Resistance Rth K/W < 0.22 Thermal Impedance Rti °Cmm²/W
Thermal Conductivity λ W/mK > 5.5 Electrical Properties Breakdown Voltage Ud;ac kV > 3.0 Volume Resistivity Ωm 16×1012 Dielectric Loss Factor tan δ 1 1.0×10-3 Dielectric Constant εr 1 2.7 Mechanical Properties Measured Thickness (±10%) mm 0.5 Hardness Shore 00 50 – 60 Youngs Modulus* N/cm² 98.5 Physical Properties Application Temperature °C -40 to +180 Flame Class UL 94V-0 Total Mass Loss TML Ma.-% < 0.35